LYCCL-170
时间：2025-08-22 10:48:15 点击：
18
High Tg Lead Free
半固化片( Prepreg)-B-STAGE 品名：LYPP-170
覆铜板( Laminates)-C-STAGE 品名：LYCCL-170
UL No: E321892
产品特性
FR4.0 Tg 170 无铅制程兼容 Compatible with Lead-free process
多功能环氧树脂，更稳定的尺寸安定性和可靠的通孔性。
Multifunctional epoxy resin, more stable D/S and reliable through-hole properties
UV Blocking和AOI兼容，可以提高PCB生产效率。
UV Blocking and AOI compatibility can improve PCB production efficiency
优良的耐热性能、机械性能、电性能、化学性能。
Excellent heat resistance, mechanical properties, electrical properties, and chemical
properties
产品应用 Product Application
电脑、仪器仪表、摄像机、通讯设备、电子游戏机、工业控制、电源、汽车等
Computers, instruments, cameras, communication equipment,
electronic game ,industrial control, power supply Automotive, etc
适用于高多层PCB
Suitable for high and multi-layer PCB
上一篇：LYCCL-150
下一篇：LYCCL-600N
